IEC 60749-32 pdf download.Semiconductor devices – Mechanical and climatic test methods
1 Scope and object
This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. NOTE This test is identical to the test method contained in 1.2 of chapter 4 of IEC 60749 (1996), apart from the addition of this clause, the addition of titles to clauses 2 and 3 and renumbering.
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60695-2-2:1995, Fire hazard testing – Part 2: Test methods – Section 2: Needle-flame test
3 Test procedure
This test shall be in accordance with the needle-flame test, with the following specific requirements: a) preconditioning: none; b) number of test specimens: three, unless otherwise stated in the detail specification; c) position of the specimen: as per figure 1b of IEC 60695-2-2; d) surface to be tested and point of application: as per figure 1b of IEC 60695-2-2; e) underlying layer: paper on pinewood, according to clause 4 of IEC 60695-2-2; f) duration of application of the flame (t a ): 10 s; g) duration of burning: 10 s; h) extent of burning: it shall not extend over a surface significantly greater than that touched by the flame during its application.