IEC 60749-10 pdf download.Semiconductor devices – Mechanical and climatic test methods
This part of IEC 60749 describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages. In general, this mechanical shock test is in conformity with IEC 60068-2-27 but, due to specific requirements of semiconductors, the clauses of this standard apply.
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-27:1987, Environmental testing. Part 2: Tests – Test Ea and guidance: Shock
3 Test apparatus
The shock testing apparatus shall be capable of providing shock pulses of 5 000 m/s 2 and 15 000 m/s 2 (peak) with a pulse duration between 0,5 ms and 1,0 ms to the body of the device. The acceleration pulse as determined from the unfiltered output of a transducer with natural frequency greater than or equal to five times the frequency of the shock pulse being established shall be a half-sine waveform with an allowable distortion not greater than ±20 % of the specified peak acceleration. The pulse duration shall be measured between the points at 10 % of the peak acceleration during rise time and 10 % of the peak acceleration during decay time. Absolute tolerances of the pulse duration shall be ±30 % of the specified duration.
The shock testing apparatus shall be mounted on a sturdy laboratory table or equivalent base and levelled before use. The device shall be rigidly mounted or restrained by its case with suitable protection for the leads. Means may be provided to prevent the shock from being repeated due to “bounce” in the apparatus. Unless otherwise specified, the device shall be subject to five shock pulses of the peak level (g) specified in the selected test condition and for the pulse duration specified in each of the orientations X 1 , X 2 , Y 1 , Y 2 , Z 1 , and Z 2 . One required orientation (Y 1 ) shall be defined as that one in which the internal element(s) tends to be removed from its mount. Unless otherwise specified, test condition B shall apply.
4.1 Test measurement Hermeticity tests, visual examination, and electrical measurements (consisting of parametric and functional tests) shall be performed. 4.2 Failure criteria A device shall be considered a failure if hermeticity cannot be demonstrated, if parametric limits are exceeded, or if functionality cannot be demonstrated under the conditions specified in the applicable procurement document. Mechanical damage such as cracking, chipping, or breaking of the package will also be considered as a failure, provided such damage was not caused by fixturing or handling and the damage is critical to the component performance in the specific application.
The following details shall be specified in the applicable procurement document: a) Test condition, if other than test condition B (see Table 1). b) Electrical measurements (see 4.1). c) Sample size and accept number. d) Hermetic leak rate (if applicable) (see 4.1).